In the global 3D vision perception industry, competition among ToF sensors centers on system reliability and all-scenario robustness. Boasting cross-border IDM layout, Cisense Sensors leverages cross-continental collaboration between Italy-based LFoundry wafer fab and domestic Chinese teams. It builds a closed full-stack technological ecosystem covering SPAD pixel design, anti-sunlight algorithms, optical systems and automotive-grade mass production, effectively resolving the long-standing industry issue of performance degradation.

1. Chip Customization

The professional ToF chip customization team delivers tailored high-quality solutions. With solid expertise and rich experience, the team designs application-specific chips complying with diverse performance metrics. Close communication and cooperation ensure products meet expected performance and quality standards. Customized services are available for projects of all sizes to satisfy individualized client demands.

2. Pixel Design

SPAD efficiency serves as a core indicator of photodetector performance, determined by active area size, doping concentration, geometric fill factor and material quality. Cisense boasts profound expertise in SPAD pixel design, continuously optimizing the balance between photon detection efficiency and dark count noise to underpin high-performance system products.

3. Analog Circuitry

Analog circuits are indispensable for direct ToF technology, which calculates object distance by precisely measuring laser round-trip time. They amplify and process faint reflected optical signals to secure measuring accuracy, suppress noise interference and elevate signal-to-noise ratio and operational stability. Equipped with proprietary technologies and mature toolchains, the team accelerates iterative design and delivers optimal outcomes.

4. Digital Algorithms

Digital circuits and anti-sunlight algorithms underpin stable ToF operation. Digital circuits enable accurate digital signal processing and transmission. Targeting intense light interference, anti-sunlight algorithms adopt histogram analysis, adaptive filtering and narrow-band optical filtering to enhance system robustness. Supported by seasoned engineers and algorithm specialists, customized high-performance solutions are developed for varied scenarios.

5. System Design

Four core elements define ToF system performance:

• Laser source: Determines beam brightness and quality; high-power narrow-spectrum lasers suit long-distance detection.

• Optical system: Governs beam shape and direction; narrow field-of-view and high numerical aperture lenses apply to long-range scenarios.

• Sensor: Captures reflected light and flight time; high-sensitivity low-noise sensors deliver superior detection performance.

• Signal processing algorithm: Converts raw data into distance readings; low-complexity high-precision algorithms are preferred.

Denoising, pile-up suppression and anti-glare algorithms are also integrated. Comprehensive hardware and software strengths are required to build complete ToF systems.

6. Optical Design

Optical design shapes laser beams and collects reflected light, covering laser emitters, collimators, beam expanders, lenses and optical filters. Design parameters are adjusted according to field of view, detection range and laser wavelength. Narrow view and high-aperture lenses fit long-distance use, while wide view and low-aperture counterparts apply to short-range sensing. Design optimization minimizes scattered light and improves signal quality. Experienced optical engineers co-develop premium schemes to maximize ToF system potential.

7. Mass Production Capacity

Backed by the group’s IDM advantages, self-owned Italian LFoundry wafer fab holds IATF 16949:2016 automotive quality certification. Supported by automotive-grade platforms and automated production lines, steady mass production is realized for R5001, M8001, i2001 and CS series modules. Solutions cater to home appliances, industrial equipment, robots, consumer electronics and automotive sectors. Flexible manufacturing swiftly responds to specification updates and market demands, guaranteeing large-scale deployment.

Full-stack capabilities bring three core merits: accelerated product iteration via streamlined internal collaboration, in-depth scenario adaptation through bottom-up chip customization, and stable supply chain ensured by consistent production capacity and workmanship under IDM model.

As 3D perception expands from indoor to outdoor scenarios and from consumer electronics to industrial and automotive fields, full-stack competitiveness becomes a decisive competitive moat. Cisense Sensors will further enhance full-stack technological layout, jointly expand application boundaries with industry partners, and enable reliable and pervasive depth sensing.